Application: | Structure Ceramic |
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Type: | Ceramic Parts |
Color: | Grey |
Features: | High Strength |
Name: | Aluminum Nitride Aln Ceramic Substrate |
Temperature: | 1800c |
Samples: |
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Customization: |
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High Polished Aluminum Nitride AlN Ceramic Substrate is our main product.
Thermal conductivity Aluminium Nitride AlN substrate high thermal conductivity with strong electrical resistance, making AlN an excellent solution for many electronic applications.
High Polished Aluminum Nitride AlN Ceramic Substrate Usage:
Thermal stability up to at least 1800°C
Favorable mechanical characteristics extending into the high temperature range.
Low thermal expansion and resistance to thermal shock.
Special optical and acoustic characteristics.
Unusually high thermal conductivity combined with good electrical insulation characteristics.
Exceptional stability when exposed to many molten salts.
High Polished Aluminum Nitride AlN Ceramic Substrate Physical Properties
Flexural strength is 300 ± 5MPa
Coefficient of thermal expansion is 5.6x10-6K-1 (20-1000°C)
Thermal conductivity is 100-200 Wm-1K-1
Insulation resistance is >1012Ωcm (20°C)
High Polished Aluminum Nitride AlN Ceramic Substrate package and delivery
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