Application: | Structure Ceramic |
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Type: | Ceramic Parts |
Color: | Grey |
Features: | High Strength |
Name: | Heat Sink Aluminum Nitride Ceramic Substrate |
Temperature: | 1800c |
Samples: |
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Customization: |
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Heat Sink Aluminum Nitride Ceramic Substrate Brief Introduction.
Alumina Nitride (AlN) ceramic is an excellent material for many electronic applications. It is high thermal conductivity and strong electrical resistance.
AlN has found to replace BeO in semiconductor industry, it has much lower thermal expansion than BeO or Alumina, closely matchs that of the Silicon wafers used in Electronics.
Heat Sink Aluminum Nitride Ceramic Substrate Features:
Heat Sink Aluminum Nitride Ceramic Substrate Technical Data
Technical Data of AlN Ceramic | |
Color | Gray |
Density (g/cm3) | 3.3 |
Thermal Conductivity (30ºC,W/m.k) | ≥170 |
Linear Expansion Coefficient (25-3000ºC, 10-6 / ºC) |
4.00 |
Surface Roughness (μm) | 0.2-0.6 |
Heat Sink Aluminum Nitride Ceramic Substrate package and delivery
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