Customization: | Available |
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Application: | Structure Ceramic |
Type: | Ceramic Parts |
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Polished Aluminum Nitride (ALN) Ceramic Wafer is our main product.
Polished Aluminum Nitride (ALN) Ceramic Wafer high thermal conductivity with strong electrical resistance, making AlN an excellent solution for many electronic applications.
Polished Aluminum Nitride (ALN) Ceramic Wafer Usage:
Thermal stability up to at least 1800°C
Favorable mechanical characteristics extending into the high temperature range.
Low thermal expansion and resistance to thermal shock.
Special optical and acoustic characteristics.
Unusually high thermal conductivity combined with good electrical insulation characteristics.
Exceptional stability when exposed to many molten salts.
Polished Aluminum Nitride (ALN) Ceramic Wafer Physical Properties
Flexural strength is 300 ± 5MPa
Coefficient of thermal expansion is 5.6x10-6K-1 (20-1000°C)
Thermal conductivity is 100-200 Wm-1K-1
Insulation resistance is >1012Ωcm (20°C)
Polished Aluminum Nitride (ALN) Ceramic Wafer package and delivery